The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2023
Filed:
Apr. 02, 2018
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Jeremy Ecton, Gilbert, TX (US);
Hiroki Tanaka, Chandler, AZ (US);
Kristof Kuwawi Darmawikarta, Chandler, AZ (US);
Oscar Ojeda, Chandler, AZ (US);
Arnab Roy, Chandler, AZ (US);
Nicholas Haehn, Scottsdale, AZ (US);
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/14 (2006.01); H01L 23/00 (2006.01); H01L 21/027 (2006.01); G03F 7/039 (2006.01); G03F 7/038 (2006.01); G03F 7/20 (2006.01); G03F 7/26 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); G03F 7/038 (2013.01); G03F 7/039 (2013.01); G03F 7/20 (2013.01); G03F 7/26 (2013.01); H01L 21/0274 (2013.01); H01L 21/4857 (2013.01); H01L 23/145 (2013.01); H01L 23/49822 (2013.01); H01L 23/49866 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01);
Abstract
Disclosed herein are via-trace structures with improved alignment, and related package substrates, packages, and computing device. For example, in some embodiments, a package substrate may include a conductive trace, and a conductive via in contact with the conductive trace. The alignment offset between the conductive trace and the conductive via may be less than 10 microns, and conductive trace may have a bell-shaped cross-section or the conductive via may have a flared shape.