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For the Inventor, By the Inventor

Grand Prairie, TX, United States of America

Andy Quang Tran

USPTO Granted Patents = 15 

Average Co-Inventor Count = 2.6

ph-index = 3

Forward Citations = 19(Granted Patents)


Company Filing History:

goldMedal15 out of 29,263 
 
Texas Instruments Corporation
 patents

Years Active: 2014-2023

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15 patents (USPTO):Explore Patents
1. 11769247 - Exposed pad integrated circuit package (2023-09-26),
2. 11195269 - Exposed pad integrated circuit package (2021-12-07),
3. 10580723 - Flat no-lead packages with electroplated edges (2020-03-03),
4. 10541194 - Semiconductor package with interconnected leads (2020-01-21),
5. 10366947 - Flat no-lead packages with electroplated edges (2019-07-30),
6. 9768098 - Packaged semiconductor device having stacked attached chips overhanging the assembly pad (2017-09-19),
7. 9721859 - Semi-hermetic semiconductor package (2017-08-01),
8. 9608158 - Proximity sensor having light-blocking structure in leadframe and method of making same (2017-03-28),
9. 9576886 - Flat no-lead packages with electroplated edges (2017-02-21),
10. 9515059 - Proximity sensor having light-blocking structure in leadframe and method of making same (2016-12-06),
11. 9373569 - Flat no-lead packages with electroplated edges (2016-06-21),
12. 9219019 - Packaged semiconductor devices having solderable lead surfaces exposed by grooves in package compound (2015-12-22),
13. 9171830 - Fabricating a proximity sensor having light-blocking structure in leadframe (2015-10-27),
14. 8994154 - Proximity sensor having light blocking structure in leadframe (2015-03-31),
15. 8769469 - System and method of crossover determination in differential pair and bondwire pairs to minimize crosstalk (2014-07-01),

Title: The Innovative Contributions of Andy Quang Tran

Introduction

Andy Quang Tran is a notable inventor based in Grand Prairie, TX (US). He has made significant contributions to the field of integrated circuit packaging, holding a total of 15 patents. His work has advanced the technology used in electronic devices, making them more efficient and reliable.

Latest Patents

One of Andy's latest patents is for an exposed pad integrated circuit package. This innovation includes an IC assembly featuring a thermal pad with a top surface and a bottom surface, along with at least one peripheral surface portion that extends transversely and is continuous with the bottom surface. The design allows the bottom surface and the peripheral surface to be exposed through a layer of mold compound. Additionally, he has developed methods for creating this exposed pad IC package assembly. One method involves optically inspecting a solder bond that connects the thermal pad of the exposed pad IC package to a printed circuit board. Another method includes wave soldering the exposed pad of the IC package to a printed circuit board.

Career Highlights

Andy Quang Tran is currently employed at Texas Instruments Corporation, where he continues to innovate and develop new technologies. His expertise in integrated circuit packaging has made him a valuable asset to the company and the industry as a whole.

Collaborations

Throughout his career, Andy has collaborated with talented individuals such as Alok Kumar Lohia and Reynaldo Corpuz Javier. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Andy Quang Tran's contributions to the field of integrated circuit packaging exemplify the spirit of innovation. His patents and ongoing work at Texas Instruments Corporation highlight his commitment to advancing technology in the electronics industry.

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