The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
May. 24, 2016
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Reynaldo Corpuz Javier, Plano, TX (US);
Alok Kumar Lohia, Dallas, TX (US);
Andy Quang Tran, Grand Prairie, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49548 (2013.01); H01L 23/293 (2013.01); H01L 23/3675 (2013.01); H01L 23/49579 (2013.01); H01L 24/09 (2013.01); H01L 24/29 (2013.01); H01L 24/46 (2013.01); H01L 2224/2908 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29164 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/01029 (2013.01);
Abstract
A lead frame sheet of flat no-lead lead frames having a semiconductor die on a die pad, terminals, and plastic encapsulation except on a back side of the sheet to provide an exposed thermal die pad, exposed side walls, and exposed back sides of the terminals. A solder wetable metal or metal alloy plating layer is on the back side and on the exposed the walls of the terminals. The exposed thermal pad and the back side of the terminals each include a contact region which lacks the plating layer.