Company Filing History:
Years Active: 2015-2023
Title: Innovative Contributions of Inventor Reynaldo Corpuz Javier
Introduction
Reynaldo Corpuz Javier is an accomplished inventor based in Plano, Texas. With a remarkable portfolio of nine patents, he has made significant contributions to the field of integrated circuit packaging. His innovative designs and methodologies have paved the way for advancements in electronic manufacturing.
Latest Patents
Among his notable patents is the design of an exposed pad integrated circuit (IC) package. This innovative assembly features a thermal pad with both top and bottom surfaces, including at least one peripheral surface portion that extends transversely and continuously with the bottom surface. The design ensures that the bottom surface and the peripheral surface are exposed through a layer of mold compound. Additionally, he has developed methods for creating this IC package assembly, including the optical inspection of solder bonds and wave soldering techniques to secure the exposed pad to printed circuit boards.
Career Highlights
Reynaldo Corpuz Javier is a prominent inventor at Texas Instruments Corporation, where he leverages his expertise in electronic design and manufacturing. His work not only enhances the functionality of electronic devices but also improves manufacturing processes, making them more efficient.
Collaborations
Throughout his career, Reynaldo has collaborated with talented coworkers, including Alok Kumar Lohia and Andy Quang Tran. These partnerships have fostered an environment of innovation and creativity, leading to groundbreaking advancements in integrated circuit technology.
Conclusion
Reynaldo Corpuz Javier continues to be a leading figure in the realm of integrated circuit packaging. His extensive patent portfolio and commitment to innovation demonstrate his dedication to advancing technology in the electronics industry. With each patent, he inspires future inventors to push the boundaries of what's possible.