The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2017

Filed:

Apr. 15, 2016
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Alok Kumar Lohia, Dallas, TX (US);

Reynaldo Corpuz Javier, Plano, TX (US);

Andy Quang Tran, Grand Prairie, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 29/06 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4952 (2013.01); H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 23/49513 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49575 (2013.01); H01L 24/85 (2013.01); H01L 25/50 (2013.01); H01L 29/0657 (2013.01); H01L 23/3107 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/181 (2013.01);
Abstract

A semiconductor device comprising a stack of semiconductor chips. The semiconductor chips have an electrically active side and an opposite electrically inactive side. The active sides bordered by an edge having first lengths and the inactive sides bordered by a parallel edge having a second lengths smaller than the first lengths. A substrate has an assembly pad bordered by a linear edge having a third length equal to or smaller than the first lengths. The inactive chip side attached to the pad so that the edge of the first lengths are parallel to the edge of the third length. The active side of the attached chip forms an overhang over the pad, when the third length is smaller than the first lengths.


Find Patent Forward Citations

Loading…