The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2016

Filed:

Oct. 26, 2015
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Andy Quang Tran, Grand Prairie, TX (US);

Lance Wright, Allen, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 25/16 (2006.01); H01L 27/14 (2006.01); H01L 21/82 (2006.01); H01L 31/0232 (2014.01); H01L 31/16 (2006.01); H01L 31/18 (2006.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 21/82 (2013.01); H01L 25/165 (2013.01); H01L 27/14 (2013.01); H01L 31/02325 (2013.01); H01L 31/16 (2013.01); H01L 31/18 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1815 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method for fabricating a semiconductor proximity sensor includes providing a flat leadframe with a first and a second surface. The second surface is solderable. The leadframe includes a first and a second pad, a plurality of leads, and fingers framing the first pad. The fingers are spaced from the first pad by a gap which is filled with a clear molding compound. A light-emitting diode (LED) chip is assembled on the first pad and encapsulated by a first volume of the clear compound. The first volume outlined as a first lens. A sensor chip is assembled on the second pad and encapsulated by a second volume of the clear compound. The second volume outlined as a second lens. Opaque molding compound fills the space between the first and second volumes of clear compound and forms walls rising from the frame of fingers to create an enclosed cavity for the LED. The pads, leads, and fingers connected to a board using a layer of solder for attaching the proximity sensor.


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