This inventor holds 3 USPTO granted patents. Top assignees: Intel Corporation, Kla Tencor Corporation, Kla-Tencor Technologies Corporation. Active years: 2009-2012.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:



Years Active: 2009-2012
Title: The Innovations of Andrew Steinbach
Introduction
Andrew Steinbach is a notable inventor based in Menlo Park, CA (US). He has made significant contributions to the field of technology, particularly in the area of wafer inspection and classification. With a total of 3 patents to his name, Steinbach's work has had a considerable impact on the industry.
Latest Patents
Steinbach's latest patents include innovative computer-implemented methods for inspecting and classifying wafers. One of these methods involves detecting defects on a wafer using various defect detection parameters. These parameters are determined based on a non-spatially localized characteristic of the wafer, which is assessed using output responsive to light scattered from the wafer generated by an inspection system. Another method focuses on classifying a wafer by combining both non-spatially localized and spatially localized characteristics, enhancing the accuracy of wafer classification.
Career Highlights
Throughout his career, Andrew Steinbach has worked with prominent companies such as Kla Tencor Corporation and Kla-Tencor Technologies Corporation. His experience in these organizations has allowed him to develop and refine his innovative techniques in wafer inspection.
Collaborations
Steinbach has collaborated with talented individuals in his field, including Juergen Reich and Daniel Ivanov Kavaldjiev. These partnerships have contributed to the advancement of his research and inventions.
Conclusion
Andrew Steinbach's contributions to wafer inspection technology demonstrate his innovative spirit and dedication to advancing the field. His patents reflect a commitment to improving the accuracy and efficiency of wafer classification processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile