The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2012
Filed:
Jul. 24, 2008
Juergen Reich, Campbell, CA (US);
Louis Vintro, Menlo Park, CA (US);
Prasanna Dighe, Fremont, CA (US);
Andrew Steinbach, Menlo Park, CA (US);
Daniel Kavaldjiev, San Jose, CA (US);
Stephen Biellak, Sunnyvale, CA (US);
Juergen Reich, Campbell, CA (US);
Louis Vintro, Menlo Park, CA (US);
Prasanna Dighe, Fremont, CA (US);
Andrew Steinbach, Menlo Park, CA (US);
Daniel Kavaldjiev, San Jose, CA (US);
Stephen Biellak, Sunnyvale, CA (US);
KLA-Tencor Corp., San Jose, CA (US);
Abstract
Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.