IDiyas

For the Inventor, By the Inventor

Tokyo, Japan

Akira Owatari

USPTO Granted Patents = 13 

Average Co-Inventor Count = 4.7

ph-index = 5

Forward Citations = 50(Granted Patents)


Location History:

  • Tokyo, JP (2004 - 2011)
  • Sacramento, CA (US) (2017 - 2023)

Company Filing History:

goldMedal13 out of 2,508 
 
Ebara Corporation
 patents

Years Active: 2004-2024

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13 patents (USPTO):
1. 12157951 - Plating method, insoluble anode for plating, and plating apparatus (2024-12-03),
2. 11566339 - Plating method and plating apparatus (2023-01-31),
3. 10941504 - Plating method and plating apparatus (2021-03-09),
4. 10294581 - Plating method (2019-05-21),
5. 10294580 - Plating method and plating apparatus (2019-05-21),
6. 9708724 - Anode unit and plating apparatus having such anode unit (2017-07-18),
7. 7878144 - Electroless plating apparatus and electroless plating method (2011-02-01),
8. 7575636 - Substrate processing apparatus and substrate processing method (2009-08-18),
9. 7498261 - Method and apparatus for forming metal film (2009-03-03),
10. 7442257 - Substrate processing apparatus and substrate processing method (2008-10-28),
11. 7285492 - Method for processing substrate (2007-10-23),
12. 7087117 - Substrate processing apparatus and substrate processing method (2006-08-08),
13. 6824613 - Substrate processing apparatus (2004-11-30),

Title: Akira Owatari: Innovator in Plating Technology

Introduction

Akira Owatari is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of plating technology, holding a total of 13 patents. His work focuses on improving the efficiency and effectiveness of plating methods, particularly in the context of electronic components.

Latest Patents

Owatari's latest patents include innovative solutions such as a plating method, an insoluble anode for plating, and a plating apparatus. These inventions aim to reduce the consumption of additives in plating solutions when plating substrates that include vias or holes for forming through electrodes. The plating method involves preparing a substrate with a via or hole, utilizing a divided plating solution tank, and electroplating the substrate with specific current density parameters. Additionally, he has developed a plating method that controls the concentration of additives during the plating process, ensuring optimal performance.

Career Highlights

Akira Owatari is currently employed at Ebara Corporation, where he continues to advance his research and development in plating technologies. His work has garnered attention for its practical applications in the electronics industry, contributing to more sustainable manufacturing processes.

Collaborations

Owatari collaborates with notable colleagues, including Shingo Yasuda and Toshio Yokoyama. Their combined expertise enhances the innovative capabilities within their projects, fostering a collaborative environment that drives technological advancements.

Conclusion

Akira Owatari's contributions to plating technology exemplify the impact of innovation in the electronics sector. His patents reflect a commitment to improving manufacturing processes and sustainability.

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