The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2007
Filed:
Jan. 24, 2005
Xinming Wang, Tokyo, JP;
Daisuke Takagi, Tokyo, JP;
Akihiko Tashiro, Tokyo, JP;
Yukio Fukunaga, Tokyo, JP;
Akira Fukunaga, Tokyo, JP;
Akira Owatari, Tokyo, JP;
Yukiko Nishioka, Tokyo, JP;
Tsuyoshi Sahoda, Tokyo, JP;
Xinming Wang, Tokyo, JP;
Daisuke Takagi, Tokyo, JP;
Akihiko Tashiro, Tokyo, JP;
Yukio Fukunaga, Tokyo, JP;
Akira Fukunaga, Tokyo, JP;
Akira Owatari, Tokyo, JP;
Yukiko Nishioka, Tokyo, JP;
Tsuyoshi Sahoda, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A substrate processing method can securely form a metal film by electroless plating on an exposed surface of a base metal, such as interconnects, with increased throughput and without the formation of voids in the base metal. The substrate processing method includes: cleaning a surface of a substrate having a base metal formed in the surface with a cleaning solution comprising an aqueous solution of a carboxyl group-containing organic acid or its salt and a surfactant as an additive; bringing the surface of the substrate after the cleaning into contact with a processing solution comprising a mixture of the cleaning solution and a solution containing a catalyst metal ion, thereby applying the catalyst to the surface of the substrate; and forming a metal film by electroless plating on the catalyst-applied surface of the substrate.