Company Filing History:

9 out of 4,549

Sandisk Technologies Inc.

Years Active: 2015-2019

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10 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10290803 - Three-dimensional devices with wedge-shaped contact region and method of making thereof (2019-05-14),

2. 10256272 - Resistive memory device containing etch stop structures for vertical bit line formation and method of making thereof (2019-04-09),

3. 9673304 - Methods and apparatus for vertical bit line structures in three-dimensional nonvolatile memory (2017-06-06),

4. 9673257 - Vertical thin film transistors with surround gates (2017-06-06),

5. 9666799 - Concave word line and convex interlayer dielectric for protecting a read/write layer (2017-05-30),

6. 9620712 - Concave word line and convex interlayer dielectric for protecting a read/write layer (2017-04-11),

7. 9437543 - Composite contact via structure containing an upper portion which fills a cavity within a lower portion (2016-09-06),

8. 9368601 - Method for forming oxide below control gate in vertical channel thin film transistor (2016-06-14),

9. 9281314 - Non-volatile storage having oxide/nitride sidewall (2016-03-08),

10. 9177964 - Methods of forming sidewall gates (2015-11-03),

Title: Akira Nakada: A Pioneer in Three-Dimensional Device Innovations

Introduction

Akira Nakada, an accomplished inventor based in Yokkaichi, Japan, holds an impressive portfolio of 10 patents. His innovative contributions primarily focus on the realm of three-dimensional devices, showcasing his expertise in advanced electrical engineering and materials science.

Latest Patents

Among his most recent patents is a groundbreaking invention titled "Three-dimensional devices with wedge-shaped contact region and method of making thereof." This patent outlines a unique approach to providing electrical contacts to multiple conductive layers within a three-dimensional device structure. The design features a cavity formed in a dielectric matrix layer that incorporates a wedge-shaped region, allowing for enhanced electrical performance through a series of conformal deposition processes.

Another significant patent by Nakada is for a "Resistive memory device containing etch stop structures for vertical bit line formation and method of making thereof." This invention elaborates on a novel three-dimensional ReRAM device design that includes protective etch stop dielectric materials, ultimately contributing to the efficiency and precision of semiconductor fabrication processes.

Career Highlights

Throughout his career, Nakada has made notable advancements while working with renowned companies such as SanDisk Technologies Inc. and SanDisk 3D LLC. His technical expertise and innovative designs have not only led to multiple patents but have also positioned him as a leading figure in the field of device engineering.

Collaborations

In his journey, Akira Nakada has collaborated with distinguished professionals like Michiaki Sano and Naohito Yanagida. These partnerships have been instrumental in the development of his innovative ideas, further enhancing the capabilities of three-dimensional device technology.

Conclusion

Akira Nakada stands out as a significant contributor to the field of three-dimensional devices. With a robust patent portfolio and valuable collaborations, his work continues to inspire advancements in electrical engineering and materials science. His inventions represent a crucial step forward in the ongoing evolution of technology and innovation.

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