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For the Inventor, By the Inventor

Sanda, Japan

Akihiro Masuda

This inventor holds 17 USPTO granted patents and 7 EPO patents. Top assignees: Mitsubishi Materials Corporation, Genesis Technology Inc., Nippon Pillar Packing Co., Ltd.. Active years: 1997-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Akihiro Masuda. Retrieved from https://idiyas.com/inventor/akihiro-masuda

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17

% Patents Active = 64.7

 

Average Co-Inventor Count = 4.9

ph-index = 8

Forward Citations = 530(Granted Patents)


Location History:

  • Ohmiya, JP (1997)
  • Omiya, JP (2004 - 2006)
  • Hyogo, JP (2013)
  • Sanda, JP (2014 - 2016)
  • Fukuchiyama, JP (2017)

Company Filing History:

goldMedal6 out of 1,555 
 
Mitsubishi Materials Corporation
 patents
silverMedal5 out of 9 
 
Genesis Technology Inc.
 patents
bronzeMedal5 out of 274 
 
Nippon Pillar Packing Co., Ltd.
 patents
4. 1 out of 10 
 
Daiwa Fine Chemicals Co., Ltd.
 patents
5. 1 out of 1 
 
Genesis Technology Incorporation
 patent
where one patent can have more than one assignee

Years Active: 1997-2017

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17 patents (USPTO):Explore Patents
1. 9644774 - Welding joint and welding method for same, welding device, welding joint, resin pipe welding device and welding method (2017-05-09),
2. 9506163 - Method of electroplating with Sn-alloy and apparatus of electroplating with Sn-alloy (2016-11-29),
3. 9222608 - Resinous tube joint (2015-12-29),
4. 9151427 - Resin pipe joint (2015-10-06),
5. 9109728 - Resinous pipe joint (2015-08-18),
6. 9108861 - Tin(II) oxide powder for replenishing tin component of tin-alloy plating solution and method for manufacturing said powder (2015-08-18),
7. 9067800 - Method for manufacturing tin(II) oxide powder for replenishing tin component of tin-alloy plating solution, and tin (II) oxide powder manufactured using said method (2015-06-30),
8. 8822326 - Method for manufacturing Sn alloy bump (2014-09-02),
9. 8568114 - Reciprocating pump (2013-10-29),
10. 7015710 - Contact probe and probe device (2006-03-21),
11. 6937042 - Contact probe and probe device (2005-08-30),
12. 6919732 - Contact probe and probe device (2005-07-19),
13. 6917211 - Contact probe and probe device (2005-07-12),
14. 6903563 - Contact probe and probe device (2005-06-07),
15. 6900647 - Contact probe and probe device (2005-05-31),

Title: Akihiro Masuda: Innovator in Welding and Electroplating Technologies

Introduction

Akihiro Masuda is a prominent inventor based in Sanda, Japan, known for his significant contributions to welding and electroplating technologies. With a total of 17 patents to his name, Masuda has developed innovative solutions that address various challenges in these fields.

Latest Patents

Masuda's latest patents include a welding joint and welding method, a welding device, and a resin pipe welding device. The synthetic resin-made welding joint is designed to facilitate the welding of synthetic resin-made tubes by utilizing heating means that surround the pipe end portion. Additionally, he has developed a method of electroplating with Sn-alloy, which addresses the deposition of metals on an anode during the electroplating process. This method involves dividing a plating tank into cathode and anode cells, allowing for efficient electroplating while using a soluble anode.

Career Highlights

Throughout his career, Akihiro Masuda has worked with notable companies such as Mitsubishi Materials Corporation and Genesis Technology Inc. His experience in these organizations has contributed to his expertise in welding and electroplating technologies.

Collaborations

Masuda has collaborated with several professionals in his field, including Hideaki Yoshida and Toshinori Ishii. These collaborations have further enhanced his innovative capabilities and contributed to the development of his patented technologies.

Conclusion

Akihiro Masuda's work in welding and electroplating has made a significant impact on the industry. His innovative patents and collaborations reflect his dedication to advancing technology in these fields.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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