The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Jan. 16, 2012
Takeshi Hatta, Sanda, JP;
Akihiro Masuda, Sanda, JP;
Takeshi Hatta, Sanda, JP;
Akihiro Masuda, Sanda, JP;
Mitsubishi Materials Corporation, Tokyo, JP;
Abstract
Provided is a method for manufacturing an Sn alloy bump, wherein composition of the Sn alloy bump can be readily controlled. The method for manufacturing an Sn alloy bump formed of an alloy composed of Sn and other one or more types of metals has a step of forming an Sn layer on an electrode pad in a resist opening formed on a substrate by electrolytic plating; a step of laminating Sn and an alloy layer on the Sn layer by electrolytic plating; and a step of forming an Sn alloy bump by melting the Sn layer and the laminated alloy layer after removal of a resist.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile