The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2016

Filed:

Feb. 12, 2013
Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Takeshi Hatta, Sanda, JP;

Akihiro Masuda, Sanda, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 17/00 (2006.01); C25D 3/60 (2006.01); C25D 21/18 (2006.01); C25D 17/02 (2006.01); C25D 21/14 (2006.01); C25D 3/56 (2006.01);
U.S. Cl.
CPC ...
C25D 17/02 (2013.01); C25D 3/56 (2013.01); C25D 3/60 (2013.01); C25D 17/002 (2013.01); C25D 21/14 (2013.01); C25D 21/18 (2013.01);
Abstract

To provide a method of electroplating with Sn-alloy in which a problem of deposition of metals on an anode when electroplating with Sn-alloy such as Sn—Ag based-alloy or the like is performed is solved and a soluble anode is enabled to be used. Dividing an inside of a plating tank into a cathode cell and an anode cell by an anion-exchange membrane; supplying plating solution including Sn ions to the cathode cell; supplying acid solution to the anode cell; electroplating by energizing an object to be plated in the cathode cell and an anode made of Sn in the anode cell; and using the acid solution including Sn ions liquated out form the anode made of Sn along with progress of plating as replenishing solution of Sn ions for plating solution in the cathode cell.


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