The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2005
Filed:
Aug. 02, 2004
Hideaki Yoshida, Sanda, JP;
Toshinori Ishii, Sanda, JP;
Atushi Matsuda, Sanda, JP;
Mituyoshi Ueki, Sanda, JP;
Noriyoshi Tachikawa, Sanda, JP;
Tadashi Nakamura, Sanda, JP;
Naoki Katou, Sanda, JP;
Shou Tai, Sanda, JP;
Hayato Sasaki, Sanda, JP;
Naohumi Iwamoto, Sanda, JP;
Akihumi Mishima, Omiya, JP;
Toshiharu Hiji, Omiya, JP;
Akihiro Masuda, Omiya, JP;
Hideaki Yoshida, Sanda, JP;
Toshinori Ishii, Sanda, JP;
Atushi Matsuda, Sanda, JP;
Mituyoshi Ueki, Sanda, JP;
Noriyoshi Tachikawa, Sanda, JP;
Tadashi Nakamura, Sanda, JP;
Naoki Katou, Sanda, JP;
Shou Tai, Sanda, JP;
Hayato Sasaki, Sanda, JP;
Naohumi Iwamoto, Sanda, JP;
Akihumi Mishima, Omiya, JP;
Toshiharu Hiji, Omiya, JP;
Akihiro Masuda, Omiya, JP;
Genesis Technology Incorporated, Nishiwaki, JP;
Abstract
A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.