Mitsubishi Materials Corporation

Nippon Pillar Packing Co., Ltd.

Genesis Technology Inc.

Daiwa Fine Chemicals Co., Ltd.

Genesis Technology Incorporation

Akihiro Masuda

Hideaki Yoshida

Toshinori Ishii

Hayato Sasaki

Tadashi Nakamura

Naoki Katou

Akihumi Mishima

Shou Tai

Mituyoshi Ueki

Naohumi Iwamoto

Toshiharu Hiji

Noriyoshi Tachikawa

Atushi Matsuda

Masateru Yamada

Ryo Imanishi

Takehiro Nakamura

Kazukiyo Teshima

Takayuki Kishimoto

Toshiyuki Fukumoto

Takuma Katase

Takeshi Nakagawa

Kanji Kuba

Takeshi Hatta

Naoki Uchiyama

Yoshiaki Okuhama

Masakazu Yoshimoto

Seishi Masaki

Masayoshi Kohinata

Mitsuo Mori

Masaru Misaki

Teshima Kazukiyo

Imanishi Ryo

Kishimoto Takayuki

Fukumoto Toshiyuki

Nakagawa Takeshi

A synthetic resin-made welding joint that has a pipe end portion into which an end portion of a synthetic resin-made tube is to be fitted and inserted, and that is configured so that the pipe end portion and the tube end portion which is fitted and inserted thereinto are enabled to be welded together by heating of heating means which externally surrounds the pipe end portion, therefore, a synthetic resin-made holder which is fitted and attached onto the pipe end portion is disposed, and a flange for ensuring a radial expansion gap with respect to the heating means is integrally formed in the holder.

Welding joint and welding method for same, welding device, welding joint, resin pipe welding device and welding method

To provide a method of electroplating with Sn-alloy in which a problem of deposition of metals on an anode when electroplating with Sn-alloy such as Sn&#x2014;Ag based-alloy or the like is performed is solved and a soluble anode is enabled to be used. Dividing an inside of a plating tank into a cathode cell and an anode cell by an anion-exchange membrane; supplying plating solution including Sn ions to the cathode cell; supplying acid solution to the anode cell; electroplating by energizing an object to be plated in the cathode cell and an anode made of Sn in the anode cell; and using the acid solution including Sn ions liquated out form the anode made of Sn along with progress of plating as replenishing solution of Sn ions for plating solution in the cathode cell.

Method of electroplating with Sn-alloy and apparatus of electroplating with Sn-alloy

A resin pipe joint including: a synthetic resin-made joint body including an inner cylinder portion, an external thread portion, and a radial groove m into which an end of a tube enters; and a union nut that is made of a transparentable fluorine resin, and the union nut including an internal thread portion, a seal peripheral edge which presses a tip end portion of a tube flared portion, a slipping-off prevention peripheral edge which is actable on a large-diameter portion of a flaring changing region, and a pressing inner peripheral portion which is externally fittable to a flared straight portion.

Resinous tube joint

In a resin pipe joint having a configuration where, by a screw advancement of a union nut caused by screwing an internal thread to an external thread in a state where a tube is externally fitted to an inner cylinder to form a flared portion, a flaring changing region is pressed by a seal pressing portion, a torque varying portion in which projecting portions of a joint body and recess portions of the union nut are fitted to or unfitted from each other by a flexural displacements of the projecting portions in the direction of the axis in accordance with fastening rotation of the union nut from the vicinity of a portion in front of an end of the screw advancement, the screw advancement being caused by pressing of the seal pressing portion against the flaring changing region is configured.

Resin pipe joint

A resin pipe joint has: a synthetic resin-made joint body including an inner cylinder portion and an external thread portion; and a synthetic resin-made union nut including: an internal thread portion; a seal peripheral edge which is actable on a tip-end portion of a tube flared portion; a slipping-off prevention peripheral edge which is actable on a large-diameter portion of the flaring changing region; and a pressing inner peripheral portion which is externally fittable to a flared straight portion that is fitted to a straight barrel cylinder portion.

Resinous pipe joint

An object and a problem of the present invention is to provide tin(II) oxide powder which has extremely high solubility in an acid or an acidic plating solution and excellent in storage stability in the air. The tin(II) oxide powder of the present invention is for replenishing a tin component of a tin-alloy plating solution, and comprises 100 to 5000 ppm of an antioxidant being contained in the powder with a mass ratio, and has such a dissolution rate that when 0.1 g of the tin(II) oxide powder is added to 100 ml of 100 g/L aqueous alkylsulfonic acid solution at a temperature of 25&#xb0; C. and stirred, then the powder dissolves therein within 180 seconds.

Tin(II) oxide powder for replenishing tin component of tin-alloy plating solution and method for manufacturing said powder

An object of the present invention is to provide tin(II) oxide powder which has extremely high solubility in an acid or an acidic plating solution, excellent in storage stability in the air and can heighten oxidation-preventive effect of Snion in the plating solution. The method for manufacturing tin(II) oxide powder of the present invention comprises Step () of preparing an aqueous acidic solution containing Snions, Step () of neutralizing the aqueous acidic solution by adding an aqueous alkaline solution to prepare a slurry of tin(II) hydroxide, Step () of dehydrating the prepared slurry to obtain a slurry of tin(II) oxide, Step () of separating the slurry of tin(II) oxide into a solid and a liquid to obtain tin(II) oxide, Step () of treating the obtained tin(II) oxide with an aqueous antioxidant solution, and Step () of vacuum drying the tin(II) oxide treated with the aqueous antioxidant solution.

Method for manufacturing tin(II) oxide powder for replenishing tin component of tin-alloy plating solution, and tin (II) oxide powder manufactured using said method

Provided is a method for manufacturing an Sn alloy bump, wherein composition of the Sn alloy bump can be readily controlled. The method for manufacturing an Sn alloy bump formed of an alloy composed of Sn and other one or more types of metals has a step of forming an Sn layer on an electrode pad in a resist opening formed on a substrate by electrolytic plating; a step of laminating Sn and an alloy layer on the Sn layer by electrolytic plating; and a step of forming an Sn alloy bump by melting the Sn layer and the laminated alloy layer after removal of a resist.

Method for manufacturing Sn alloy bump

A reciprocating pump having: a pump body including a suction path and a discharge path for a fluid; a pair of diaphragms; pump shafts which are attached to tip end portions of the diaphragms; a pair of pump flanges which slidably support the pump shafts, and which are integrated with the pump body through connection bodies that are placed outside the diaphragms; connecting rods which connect connecting plates attached to projecting tip-end portions that are projected from the pump flanges in the pump shafts, to each other in a state where the connecting rods are passed through the pump flanges to be placed outside the diaphragms; and a cover cylinder. The connecting rods are slidably supported through slide bearings which are supported by the pump flanges.

Reciprocating pump

A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.

Contact probe and probe device

Growing community of inventors

Sanda, Japan

Akihiro Masuda