Company Filing History:

13 out of 21,351

Mitsubishi Denki Kabushiki Kaisha

patents

1 out of 3,781

Renesas Technology Corp.

patents

1 out of 7,529

Renesas Electronics Corporation

patents

Years Active: 1989-2011

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15 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7906848 - Semiconductor device (2011-03-15),

2. 6780769 - Method of manufacturing structure for connecting interconnect lines including metal layer with thickness larger than thickness of metallic compound layer (2004-08-24),

3. 6664641 - Wiring structure for an integrated circuit (2003-12-16),

4. 6624516 - Structure for connecting interconnect lines with interposed layer including metal layers and metallic compound layer (2003-09-23),

5. 6198143 - Semiconductor device including a layer of thermally stable titanium silicide (2001-03-06),

6. 5712140 - Method of manufacturing interconnection structure of a semiconductor (1998-01-27),

7. 5677243 - Method of forming multi-layer interconnection (1997-10-14),

8. 5565708 - Semiconductor device comprising composite barrier layer (1996-10-15),

9. 5475267 - Multilayer interconnection structure for a semiconductor device (1995-12-12),

10. 5313100 - Multilayer interconnection structure for a semiconductor device (1994-05-17),

11. 5017504 - Vertical type MOS transistor and method of formation thereof (1991-05-21),

12. 4959329 - Semiconductor device (1990-09-25),

13. 4953125 - Semiconductor memory device having improved connecting structure of bit (1990-08-28),

14. 4887143 - Semiconductor device (1989-12-12),

15. 4845537 - Vertical type MOS transistor and method of formation thereof (1989-07-04),

Title: Akihiko Ohsaki: Innovator in Semiconductor Technology

Introduction

Akihiko Ohsaki is a prominent inventor based in Hyogo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 15 patents. His work focuses on enhancing the reliability and efficiency of semiconductor devices.

Latest Patents

One of Ohsaki's latest patents involves a semiconductor device that utilizes a Low-k film as an interlayer insulator. This innovation prevents the peeling of the interlayer insulator during thermal cycle tests, thereby providing a highly reliable semiconductor device. Another notable patent details a method for manufacturing a structure that connects interconnect lines, which includes a metal layer thicker than the metallic compound layer. This design aims to improve adhesion between copper interconnect lines and conductive barrier layers, addressing issues related to tensile stress and void generation.

Career Highlights

Throughout his career, Akihiko Ohsaki has worked with notable companies such as Mitsubishi Electric Corporation and Renesas Technology Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Ohsaki has collaborated with esteemed colleagues, including Masahiko Fujisawa and Atsushi Ishii. These partnerships have contributed to the advancement of his research and the successful development of his patents.

Conclusion

Akihiko Ohsaki's contributions to semiconductor technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the challenges in the field and a dedication to finding effective solutions.

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