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Tekcore Co., Ltd.

USPTO Granted Patents = 25

% Expired Patents = 44.0

Forward Citations = 204

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36 inventors (with patents filed for the assignee):

Chia-Ming Lee (10 out of 11 patents)

Jen-Inn Chyi (9 out of 39 patents)

Nien-Tze Yeh (7 out of 7 patents)

4. Hung-Cheng Lin (5 out of 14 patents)

5. Yu-Chuan Liu (5 out of 6 patents)

6. Lung-Han Peng (3 out of 22 patents)

7. Shih-Hung Lee (3 out of 3 patents)

8. Han-Ming Wu (3 out of 3 patents)

9. Wen-Chieh Hsu (3 out of 3 patents)

10. Jenn-Hwa Fu (3 out of 3 patents)

11. Kuen-Pu Lu (3 out of 3 patents)

12. Hsiang-Szu Chang (3 out of 3 patents)

13. Chia-Hsun Chen (3 out of 3 patents)

14. Wei-Jung Chung (2 out of 5 patents)

15. Cheng-Hsien Li (2 out of 16 patents)

Core Competencies:

Electrode Structure

Transparent Conductive Layer

Gallium Nitride

Vertical Light-Emitting Diode

Defect Density Reduction

Surface Roughening Method

High Brightness Device

Epitaxy

Serrated Structures

Group III-V Nitride

Ohmic Electrodes

Manufacturing Processes

25 patents: Sort by Forward Citations

1. 9997672 - Electrode structure of light emitting diode (2018-06-12),

2. 9478711 - Transparent conductive layer structure of light emitting diode (2016-10-25),

3. 8679881 - Growth method for reducing defect density of gallium nitride (2014-03-25),

4. 8378376 - Vertical light-emitting diode (2013-02-19),

5. 8101447 - Light emitting diode element and method for fabricating the same (2012-01-24),

6. D647495 - Light-emitting diode (2011-10-25),

7. D647494 - Light-emitting diode (2011-10-25),

8. D647493 - Light-emitting diode (2011-10-25),

9. 7981705 - Method of manufacturing a vertical type light-emitting diode (2011-07-19),

10. 7977254 - Method of forming a gate insulator in group III-V nitride semiconductor devices (2011-07-12),

11. 7901963 - Surface roughening method for light emitting diode substrate (2011-03-08),

12. 7799593 - Light emitting diode structure and method for fabricating the same (2010-09-21),

13. D619976 - Light-emitting diode (2010-07-20),

14. 7713769 - Method for fabricating light emitting diode structure having irregular serrations (2010-05-11),

15. 7645624 - Method for self bonding epitaxy (2010-01-12),

Company Overview

Tekcore Co., Ltd. is a prominent player in the semiconductor industry, specializing in the design and manufacturing of advanced integrated circuits and related technologies. The company focuses on delivering innovative solutions for various applications, including consumer electronics, automotive systems, and industrial automation. With a strong emphasis on research and development, Tekcore aims to enhance performance and efficiency in electronic devices, contributing to the evolution of technology in Taiwan and beyond.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

25 Patents

#3 in Nantou

#688 in Taiwan

#25,730 in the World

Tekcore Co., Ltd.

Forward Citations = 204

36 inventors:

Chia-Ming Lee (10 out of 11 patents)

Jen-Inn Chyi (9 out of 39 patents)

Nien-Tze Yeh (7 out of 7 patents)

4. Hung-Cheng Lin (5 out of 14 patents)

5. Yu-Chuan Liu (5 out of 6 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Tekcore Co., Ltd.. Retrieved from https://idiyas.com/company/tekcore-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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