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Hsinchu, Taiwan

Solid State System Co., Ltd.

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USPTO Granted Patents = 61

% Expired Patents = 6.6

Forward Citations = 470

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35 inventors (with patents filed for the assignee):

Chien-Hsing Lee (39 out of 39 patents)

Tsung-Min Hsieh (32 out of 32 patents)

Jhyy-Cheng Liou (26 out of 26 patents)

4. Cheng-Wei Tsai (10 out of 10 patents)

5. Chin-Hsi Lin (10 out of 24 patents)

6. Chih-Hung Wang (8 out of 9 patents)

7. Li-Chi Tsao (3 out of 3 patents)

8. Hitoshi Shiga (3 out of 57 patents)

9. Chun-Hao Kuo (3 out of 3 patents)

10. Chih-Wei Chen (3 out of 28 patents)

11. Ting-Chung Hu (2 out of 2 patents)

12. Chih-Hsiang Lin (2 out of 2 patents)

13. Rong-Hwa Ding (2 out of 2 patents)

14. Chien-Chu Chan (2 out of 2 patents)

15. Chin Hsi Lin (2 out of 3 patents)

Core Competencies:

Microelectromechanical Systems

MEMS Microphone

MEMS Device

Microphone Package

Fabrication Method

Calibration Circuit

Nonvolatile Memory

Flash Memory

Memory Structure

Data Processing

Sensitivity Trimming

Hermetic MEMS

61 patents: Sort by Forward Citations

1. 11498830 - Structure of micro-electro-mechanical-system microphone and method for fabricating the same (2022-11-15),

2. 11317220 - Structure of micro-electro-mechanical-system microphone (2022-04-26),

3. 11312616 - Structure of micro-electro-mechanical-system microphone and method for fabricating the same (2022-04-26),

4. 11206495 - Structure of micro-electro-mechanical-system microphone (2021-12-21),

5. 11172287 - Structure of micro-electro-mechanical-system microphone and method for fabricating the same (2021-11-09),

6. 10841710 - Package structure of micro-electro-mechanical-system microphone package and method for packaging the same (2020-11-17),

7. 10798493 - Micro-electro-mechanical systems (MEMS) device and method for fabricating the MEMS (2020-10-06),

8. 10728674 - Microphone package (2020-07-28),

9. 10390145 - Micro electro mechanical system (MEMS) microphone (2019-08-20),

10. 10250998 - Micro-electro-mechanical systems (MEMS) device and method for fabricating the MEMS (2019-04-02),

11. 9955268 - Micro-electrical-mechanical system (MEMS) microphone (2018-04-24),

12. 9321635 - Method to release diaphragm in MEMS device (2016-04-26),

13. 9271087 - Microelectro-mechanical systems (MEMS) microphone package device and MEMS packaging method thereof (2016-02-23),

14. 9264832 - Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level (2016-02-16),

15. 9126827 - Microelectromechanical system (MEMS) device and fabrication method thereof (2015-09-08),

Company Overview

Solid State System Co., Ltd., based in Hsinchu, Taiwan, specializes in the development and manufacturing of advanced microelectromechanical systems (MEMS). The company focuses on innovative MEMS microphones and devices, along with their packaging solutions. Its expertise extends to fabrication methods, calibration circuits, and nonvolatile memory technologies, including flash memory. Solid State System is dedicated to enhancing the performance and reliability of MEMS applications across various industries.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

61 Patents

#86 in Hsinchu

#348 in Taiwan

#11,930 in the World

Hsinchu, Taiwan

Solid State System Co., Ltd.

Forward Citations = 470

35 inventors:

Chien-Hsing Lee (39 out of 39 patents)

Tsung-Min Hsieh (32 out of 32 patents)

Jhyy-Cheng Liou (26 out of 26 patents)

4. Cheng-Wei Tsai (10 out of 10 patents)

5. Chin-Hsi Lin (10 out of 24 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Solid State System Co., Ltd.. Retrieved from https://idiyas.com/company/solid-state-system-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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