The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Jul. 11, 2014
Applicant:

Solid State System Co., Ltd., Hsinchu, TW;

Inventors:

Tsung-Min Hsieh, New Taipei, TW;

Chien-Hsing Lee, Hsinchu County, TW;

Cheng-Wei Tsai, Taichung, TW;

Jhyy-Cheng Liou, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); H04R 23/00 (2006.01); H04R 19/00 (2006.01);
U.S. Cl.
CPC ...
H04R 19/005 (2013.01); B81B 7/0058 (2013.01); H04R 23/006 (2013.01); B81B 7/0006 (2013.01); B81B 2201/0257 (2013.01); H04R 2201/003 (2013.01); H04R 2460/11 (2013.01);
Abstract

A micro-electrical-mechanical system (MEMS) microphone includes a MEMS structure, having a substrate, a diaphragm, and a backplate, wherein the substrate has a cavity and the backplate is between the cavity and the diaphragm. The backplate has multiple venting holes, which are connected to the cavity and allows the cavity to extend to the diaphragm. Further, an adhesive layer is disposed on the substrate, surrounding the cavity. A cover plate is adhered on the adhesive layer, wherein the cover plate has an acoustic hole, dislocated from the cavity without direct connection.


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