The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2019

Filed:

Apr. 02, 2018
Applicant:

Solid State System Co., Ltd., Hsinchu, TW;

Inventors:

Tsung-Min Hsieh, New Taipei, TW;

Cheng-Wei Tsai, Taichung, TW;

Chien-Hsing Lee, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); H04R 1/08 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81C 1/00158 (2013.01); H04R 1/083 (2013.01); B81B 2201/0257 (2013.01); H04R 2201/003 (2013.01);
Abstract

A micro electro mechanical system (MEMS) microphone includes a substrate, having a substrate opening. A supporting dielectric layer is disposed on the substrate surrounding the substrate opening. A diaphragm is supported by the supporting dielectric layer above the substrate opening, wherein the diaphragm has a bowl-like structure being convex toward the substrate opening when the diaphragm is at an operation off state. A backplate is disposed on the supporting dielectric layer over the diaphragm, wherein the backplate includes a plurality of venting holes at a region corresponding to the substrate opening.


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