The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 21, 2021

Filed:

Nov. 07, 2019
Applicant:

Solid State System Co., Ltd., Hsinchu, TW;

Inventors:

Tsung-Min Hsieh, New Taipei, TW;

Li-Chi Tsao, Taichung, TW;

Chien-Hsing Lee, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/00 (2006.01); H04R 19/04 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); H04R 7/04 (2006.01); H04R 7/18 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 3/001 (2013.01); B81B 3/0021 (2013.01); B81C 1/00158 (2013.01); H04R 7/04 (2013.01); H04R 7/18 (2013.01); H04R 19/005 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/04 (2013.01); B81C 2201/0109 (2013.01); H04R 2201/003 (2013.01); H04R 2410/03 (2013.01);
Abstract

A MEMS microphone includes a substrate. A dielectric layer is disposed on the substrate, having an opening and includes: indent region surrounding the opening; pillars extending from an indent surface at the indent region to the substrate; and an outer part surrounding the indent region and disposed on the substrate. A signal sensing space is created at the indent region between the pillars and between the pillars and the outer part. A first electrode layer is disposed on the indent surface of the dielectric layer. A second electrode layer is disposed on the substrate. A sensing diaphragm is held by the dielectric layer, including two elastic diaphragms supported by the dielectric layer; and a conductive plate between the first elastic diaphragm and the second elastic diaphragm. The conductive plate has a central part embedded in the holding structure and a peripheral part extending into the signal sensing space.


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