The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Dec. 18, 2019
Applicant:

Solid State System Co., Ltd., Hsinchu, TW;

Inventors:

Tsung-Min Hsieh, New Taipei, TW;

Cheng-Wei Tsai, Taichung, TW;

Chien-Hsing Lee, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/00 (2006.01); H04R 19/04 (2006.01); H04R 1/22 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); H04R 7/18 (2006.01); H04R 7/08 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 3/0021 (2013.01); B81C 1/00158 (2013.01); H04R 1/222 (2013.01); H04R 7/08 (2013.01); H04R 7/18 (2013.01); H04R 19/005 (2013.01); B81B 2201/0257 (2013.01); H04R 2201/003 (2013.01);
Abstract

In an embodiment, the invention provides a structure of MEMS microphone includes a substrate of semiconductor, having a first opening in the substrate. A dielectric layer is disposed on the substrate, having a dielectric opening. A diaphragm is within the dielectric opening and held by the dielectric layer at a peripheral region, wherein the diaphragm has a diaphragm opening. A back-plate is disposed on the dielectric layer, over the diaphragm. A protruding structure is disposed on the back-plate, protruding toward the diaphragm. At least one air valve plate is affixed on an end of the protruding structure within the diaphragm opening of the diaphragm. The air valve plate is activated when suffering an air flow with a pressure.


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