For the Inventor, By the Inventor

Enter assignee name

Shenzhen, China

Shennan Circuits Co., Ltd.

Calculating rank

USPTO Granted Patents = 28

EPO Patents = 1

Forward Citations = 4

Loading Chart...

Loading Chart...

39 inventors (with patents filed for the assignee):

Hua Miao (18 out of 20 patents)

Lixiang Huang (8 out of 9 patents)

Weijing Guo (6 out of 6 patents)

4. Zedong Wang (5 out of 6 patents)

5. Yuhua Zeng (5 out of 5 patents)

6. Guodong Wang (4 out of 5 patents)

7. Zhanhao Xie (4 out of 4 patents)

8. James Quilici (4 out of 4 patents)

9. Jinfeng Liu (3 out of 92 patents)

10. Xiaofeng Liu (3 out of 9 patents)

11. Changsheng Tang (3 out of 3 patents)

12. Chuanzhi Li (2 out of 2 patents)

13. Beilei Wang (2 out of 2 patents)

14. Zhicheng Yang (2 out of 4 patents)

15. Xianyou Deng (2 out of 2 patents)

Core Competencies:

Printed Circuit Board

Phased Array Antenna

Optical Fiber Circuit

Graded-Index Polymer

Integrated Transformer

Electronic Device

Voltage Regulation Module

Embedded Circuit Board

Connection Assembly

Manufacturing Method

Hybrid Circuit Board

Electromagnetic Device

28 patents: Sort by Forward Citations

1. 12495505 - Printed circuit board for phased array antenna transceiver assembly, transceiver assembly and radar (2025-12-09),

2. 12392973 - Optical fiber circuit board assembly and optical-electrical hybrid circuit board (2025-08-19),

3. 12366707 - Graded-index polymer waveguide and manufacturing method thereof (2025-07-22),

4. 12217903 - Integrated transformer and electronic device (2025-02-04),

5. 12120810 - Circuit board and preparation method therefor (2024-10-15),

6. 12114436 - Composite circuit board and method of manufacturing the same (2024-10-08),

7. 12016115 - Embedded circuit board, electronic device, and fabrication method therefor (2024-06-18),

8. 11997799 - Method for manufacturing printed circuit board (2024-05-28),

9. 11937377 - Circuit board preparation method (2024-03-19),

10. 11906791 - Connection assembly, cable plug and cable assembly (2024-02-20),

11. 11862385 - Electronic device, connector, and electromagnetic device thereof (2024-01-02),

12. 11856702 - Adapter board, method for manufacturing the same and circuit board assembly using the same (2023-12-26),

13. 11737212 - Electronic component package, electronic assembly, voltage regulation module, and voltage regulator member (2023-08-22),

14. 11711893 - Electronic component, voltage regulation module and voltage stabilizer (2023-07-25),

15. 11641719 - Manufacturing method of printed circuit board (2023-05-02),

Company Overview

Shennan Circuits Co., Ltd. is a prominent manufacturer based in Shenzhen, China, specializing in the development and production of printed circuit boards (PCBs) and related electronic components. The company focuses on advanced technologies in the electronics sector, catering to various industries including telecommunications, automotive, and consumer electronics. With a commitment to innovation, Shennan Circuits emphasizes quality and efficiency in its manufacturing processes, positioning itself as a key player in the global electronics supply chain.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

28 Patents

#159 in Shenzhen

#1,089 in China

#23,317 in the World

Shenzhen, China

Shennan Circuits Co., Ltd.

Forward Citations = 4

39 inventors:

Hua Miao (18 out of 20 patents)

Lixiang Huang (8 out of 9 patents)

Weijing Guo (6 out of 6 patents)

4. Zedong Wang (5 out of 6 patents)

5. Yuhua Zeng (5 out of 5 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Shennan Circuits Co., Ltd.. Retrieved from https://idiyas.com/company/shennan-circuits-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

Loading…