The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2024
Filed:
Dec. 30, 2021
Applicant:
Shennan Circuits Co., Ltd., Shenzhen, CN;
Inventor:
Changsheng Tang, Shenzhen, CN;
Assignee:
SHENNAN CIRCUITS CO., LTD., Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/40 (2006.01); H05K 1/11 (2006.01); H05K 3/18 (2006.01); H05K 3/26 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4007 (2013.01); H05K 1/111 (2013.01); H05K 3/188 (2013.01); H05K 3/26 (2013.01); H05K 3/424 (2013.01);
Abstract
The present application provides a method for manufacturing a printed circuit board and a printed circuit board. The method for manufacturing a printed circuit board includes: providing a core board, wherein the core board includes an insulating baseplate, and a first surface and/or a second surface opposite to the first surface of the insulating baseplate is provided with a plurality of pads; and laminating a medium layer on a side of the insulating baseplate provided with the plurality of pads to form a laminated layer at least partially embedded among the plurality of pads.