SHENZHEN, China

Changsheng Tang

This inventor holds 3 USPTO granted patents. Top assignee: Shennan Circuits Co., Ltd.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Changsheng Tang. Retrieved from https://idiyas.com/inventor/changsheng-tang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2024

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3 patents (USPTO):Explore Patents

Title: Changsheng Tang: Innovator in Circuit Board Technology

Introduction

Changsheng Tang is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of circuit board technology, holding a total of 3 patents. His innovative designs focus on enhancing the performance and efficiency of circuit boards.

Latest Patents

Changsheng Tang's latest patents include a groundbreaking circuit board and its preparation method. This circuit board features a base layer, a transmission wire layer with multiple conductor tabs, and an insulating and thermally conductive layer. The design includes gaps between the conductor tabs that expose portions of the base layer, filled with thermally conductive portions to improve heat dissipation. His second patent outlines a method for manufacturing printed circuit boards, which involves providing a core board with an insulating baseplate and laminating a medium layer to form a laminated layer embedded among multiple pads.

Career Highlights

Changsheng Tang is currently associated with Shennan Circuits Co., Ltd., where he continues to innovate and develop advanced circuit board technologies. His work has been instrumental in improving the heat dissipation performance of circuit boards, making them more efficient for various applications.

Collaborations

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Conclusion

Changsheng Tang's contributions to circuit board technology exemplify his commitment to innovation and excellence in engineering. His patents reflect a deep understanding of the challenges in circuit design and manufacturing, paving the way for future advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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