The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2023
Filed:
Nov. 20, 2020
Shennan Circuits Co., Ltd., Shenzhen, CN;
Hegen Zhang, Shenzhen, CN;
Xianyou Deng, Shenzhen, CN;
Jinfeng Liu, Shenzhen, CN;
Fuyu Xiang, Shenzhen, CN;
Bo Wang, Shenzhen, CN;
Zhicheng Yang, Shenzhen, CN;
SHENNAN CIRCUITS CO., LTD., Shenzhen, CN;
Abstract
The present disclosure provides a printed circuit board and a manufacturing method of the printed circuit board. The manufacturing method may include: at least two core plates may be provided; a composite anti-glue film assembly may be arranged at a preset position of one of the at least two core plates, the composite anti-glue film assembly may include a first anti-glue film layer, a second anti-glue film layer and a bonding layer. The first anti-glue film layer may contact the preset position. The first anti-glue film layer may be a polyimide layer. The bonding layer may be configured to bond the first anti-glue film layer and the second anti-glue film layer together to produce the composite anti-glue film assembly. Two adjacent core plates may be connected through a medium layer. The core plates may be cut-out and form the printed circuit board.