Xianyou Deng

Title: Xianyou Deng: Innovator in Circuit Board Technology

Introduction

Xianyou Deng is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of circuit board technology, holding 2 patents that showcase his innovative approach to manufacturing and design.

Latest Patents

Deng's latest patents include a composite circuit board and a method of manufacturing the same. The composite circuit board features a flexible board, rigid boards, adhesive layers, and protection glue. The adhesive layers are strategically placed between the rigid boards and the flexible board to ensure a strong bond. The design incorporates step slots and through slots that communicate to form a thinning recess, exposing the flexible board, which is then covered by protection glue.

Additionally, he has developed a manufacturing method for printed circuit boards. This method involves at least two core plates and a composite anti-glue film assembly. The assembly consists of a first anti-glue film layer, a second anti-glue film layer, and a bonding layer. The first layer, made of polyimide, is positioned at a preset location, while the bonding layer connects the two film layers to create the composite assembly. The core plates are then cut out to form the final printed circuit board.

Career Highlights

Xianyou Deng is associated with Shennan Circuits Co., Ltd., a company known for its advancements in circuit board manufacturing. His work has significantly impacted the efficiency and functionality of circuit boards in various applications.

Collaborations

Deng collaborates with talented individuals such as Zhicheng Yang and Jinfeng Liu, contributing to a dynamic work environment that fosters innovation and creativity.

Conclusion

Xianyou Deng's contributions to circuit board technology through his patents and work at Shennan Circuits Co., Ltd. highlight his role as a key innovator in the field. His advancements continue to influence the industry and pave the way for future developments.