Hegen Zhang

Title: Innovations of Hegen Zhang in Circuit Board Technology

Introduction

Hegen Zhang is a prominent inventor based in Shenzhen, China, known for his contributions to circuit board technology. With a total of two patents to his name, Zhang has made significant advancements in the field of electronics.

Latest Patents

Zhang's latest patents include a composite circuit board and a method of manufacturing the same. The composite circuit board features a flexible board, rigid boards, adhesive layers, and protection glue. The adhesive layers are strategically placed between the rigid boards and the flexible board to ensure a strong bond. The design incorporates step slots and through slots that communicate with each other, creating a thinning recess that exposes the flexible board. Additionally, the protection glue covers the steps of the thinning recess and a portion of the exposed area of the flexible board. His second patent outlines a manufacturing method for printed circuit boards, which involves the use of core plates and a composite anti-glue film assembly. This innovative method enhances the efficiency and effectiveness of circuit board production.

Career Highlights

Hegen Zhang has established himself as a key figure in the electronics industry through his work at Shennan Circuits Co., Ltd. His expertise in circuit board technology has contributed to the company's reputation for innovation and quality.

Collaborations

Zhang collaborates with talented individuals such as Zhicheng Yang and Xianyou Deng, further enhancing the innovative capabilities of his team.

Conclusion

Hegen Zhang's contributions to circuit board technology exemplify the spirit of innovation in the electronics field. His patents reflect a commitment to advancing manufacturing methods and improving product design.