The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

Feb. 06, 2024
Applicant:

Shennan Circuits Co.,ltd., Shenzhen, CN;

Inventors:

Li Chen, Shenzhen, CN;

Shuping Shan, Shenzhen, CN;

Guodong Guo, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); G01S 13/02 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4602 (2013.01); G01S 13/02 (2013.01); H05K 1/0209 (2013.01); H05K 3/0088 (2013.01); H05K 3/1258 (2013.01); G01S 2013/0245 (2013.01); H05K 2201/10098 (2013.01);
Abstract

A printed circuit board (PCB) for a phased array antenna transceiver assembly, a transceiver assembly, and a radar are provided. The PCB includes a microwave core board layer, operating in a first frequency band, where a chip carrying area is arranged on a side of the microwave core board layer, and the chip carrying area is configured to carry a chip; a digital core board layer, operating in a second frequency band and stacked on another side of the microwave core board layer away from the chip carrying area; where an interlayer connecting path is arranged on the microwave core board layer and the digital core board layer, and the interlayer connecting path is connected to the chip carrying area; and a heat dissipation member, embedded in the digital core board layer and connected to the chip carrying area.


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