This inventor holds 1 USPTO granted patent. Top assignee: Shennan Circuits Co., Ltd.. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: Shuping Shan: Innovator in Phased Array Antenna Technology
Introduction
Shuping Shan is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of electronics, particularly in the development of printed circuit boards (PCBs) for advanced communication systems. His innovative work has led to the creation of a patent that enhances the functionality of phased array antenna transceiver assemblies.
Latest Patents
Shuping Shan holds a patent for a "Printed circuit board for phased array antenna transceiver assembly, transceiver assembly and radar." This invention includes a microwave core board layer that operates in a first frequency band, featuring a chip carrying area designed to accommodate a chip. Additionally, it incorporates a digital core board layer that operates in a second frequency band, stacked on the opposite side of the microwave core board layer. The design also includes an interlayer connecting path and a heat dissipation member, which are crucial for efficient operation.
Career Highlights
Shuping Shan is currently employed at Shennan Circuits Co., Ltd., where he continues to innovate in the field of circuit design. His work has been instrumental in advancing technologies that rely on high-frequency communication systems. With a total of 1 patent, he has established himself as a key player in the industry.
Collaborations
Shuping has collaborated with talented coworkers such as Li Chen and Guodong Guo. Their combined expertise has contributed to the successful development of cutting-edge technologies in their field.
Conclusion
Shuping Shan's contributions to the field of printed circuit boards and phased array antenna technology highlight his innovative spirit and dedication to advancing electronic communication systems. His work continues to influence the industry and pave the way for future innovations.