Shanghai Xianfang Semiconductor Co., Ltd.

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USPTO Granted Patents = 3

Forward Citations = 0

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8 inventors (with patents filed for the assignee):

Liqiang Cao (3 out of 6 patents)

Peng Sun (2 out of 4 patents)

Tianfang Chen (1 out of 1 patent)

4. Yangyang Yan (1 out of 1 patent)

5. Fengwei Dai (1 out of 1 patent)

6. Peng Sun (1 out of 3 patents)

7. Quanlong Wang (1 out of 2 patents)

8. Yulong Ren (1 out of 1 patent)

3 patents: Sort by Forward Citations

1. 12772894 - Sensing chip packaging structure and method (2026-10-20),

2. 12610826 - Wafer-level chip structure, multiple-chip stacked and interconnected structure and fabricating method thereof (2026-04-21),

3. 12604730 - Chip packaging structure and preparation method therefor (2026-04-14),

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USPTO Data Jan 1 1976 - Oct 27 2026

3 Patents

#658 in Shanghai

#8,379 in China

Shanghai, China

Shanghai Xianfang Semiconductor Co., Ltd.

Forward Citations = 0

8 inventors:

Liqiang Cao (3 out of 6 patents)

Peng Sun (2 out of 4 patents)

Tianfang Chen (1 out of 1 patent)

4. Yangyang Yan (1 out of 1 patent)

5. Fengwei Dai (1 out of 1 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Shanghai Xianfang Semiconductor Co., Ltd.. Retrieved from https://idiyas.com/company/shanghai-xianfang-semiconductor

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]