Yangyang Yan

Title: Yangyang Yan: Semiconductor Packaging Inventor

Introduction

Yangyang Yan is an inventor based in Wuxi, China. His work includes semiconductor packaging technologies, with a focus on wafer-level chip structures and connections between stacked chips.

Latest Patents

Yan is associated with 1 patent: “Wafer-level chip structure, multiple-chip stacked and interconnected structure and fabricating method thereof.” The invention describes a wafer-level chip structure with a through-silicon via, an active surface containing a multilayer redistribution layer and a bump, and a second surface with an insulation dielectric layer and a frustum transition structure connected to the via. The frustum-shaped impedance transition is positioned between the exposed through-silicon via area on the wafer’s backside and the under-bump metallization. Its purpose is to improve impedance matching and reduce signal distortion caused by abrupt impedance changes.

Career Highlights

Yan has been associated with Shanghai Xianfang Semiconductor Co., Ltd. and National Center for Advanced Packaging Co., Ltd. His patent reflects work addressing signal integrity in advanced semiconductor packaging.

Collaborations

Liqiang Cao and Tianfang Chen are identified as Yan’s coworkers. Their shared professional context connects them with semiconductor and packaging-related work.

Conclusion

Yangyang Yan’s patent focuses on improving signal transmission in wafer-level and stacked-chip structures through impedance matching, highlighting his contribution to semiconductor packaging innovation.