For the Inventor, By the Inventor

Enter assignee name

Chu-nan, Taiwan

Semileds Optoelectronics Co., Ltd.

USPTO Granted Patents = 105

EPO Patents = 1

Forward Citations = 646

Loading Chart...

Loading Chart...

35 inventors (with patents filed for the assignee):

Chen-Fu Chu (47 out of 61 patents)

Wen-Huang Liu (39 out of 59 patents)

Trung Tri Doan (33 out of 434 patents)

4. Chao-Chen Cheng (28 out of 29 patents)

5. Hao-Chun Cheng (28 out of 30 patents)

6. Feng-Hsu Fan (27 out of 29 patents)

7. Jui-Kang Yen (22 out of 31 patents)

8. Jiunn-Yi Chu (17 out of 17 patents)

9. Chuong Anh Tran (13 out of 22 patents)

10. David Trung Doan (10 out of 15 patents)

11. Yi-Feng Shih (8 out of 11 patents)

12. Yung-Wei Chen (8 out of 11 patents)

13. Li-Wei Shan (8 out of 9 patents)

14. Yuan-Hsiao Chang (7 out of 8 patents)

15. Trung-Tri Doan (4 out of 4 patents)

Core Competencies:

Light Emitting Diode

LED Arrays

Epitaxial Structure

Wavelength Conversion Layers

Vertical Light Emitting Diode

Flip Chip

Semiconductor Structures

Integrated Semiconductor Systems

Lighting Devices

LED Packaging

Current Guiding Structures

Phosphor Layers

105 patents: Sort by Forward Citations

1. 12364079 - Method for making light emitting device (LED) arrays and electronic products using a temporary substrate and a carrier substrate (2025-07-15),

2. 12206051 - Light emitting diode (LED) structure having single epitaxial structure separated into light emitting zones (2025-01-21),

3. 12191434 - Method for making electronic device arrays using a temporary substrate (2025-01-07),

4. 11817536 - Method for making electronic device arrays using a temporary substrate and a carrier substrate (2023-11-14),

5. 11728461 - Single light emitting diode (LED) structure having epitaxial structure separated into light emitting zones (2023-08-15),

6. 11387397 - Method for making light emitting device (LED) arrays using a temporary substrate and a carrier substrate (2022-07-12),

7. 10964851 - Single light emitting diode (LED) structure (2021-03-30),

8. 10910535 - Method for making light emitting device LED arrays (2021-02-02),

9. 9653435 - Light emitting diode (LED) package having short circuit (VLED) die, lens support dam and same side electrodes and method of fabrication (2017-05-16),

10. 9537073 - Method for fabricating a light emitting diode (LED) die having strap layer (2017-01-03),

11. 9437794 - Method of fabricating a flip chip light emitting diode (FCLED) die having N-conductor layer (2016-09-06),

12. 9419195 - Light emitting diode (LED) die having strap layer and method of fabrication (2016-08-16),

13. 9343639 - Light emitting diode (LED) device having lens protective structure and method of fabrication (2016-05-17),

14. 9343620 - Method for fabricating a light emitting diode (LED) die having protective substrate (2016-05-17),

15. 9312455 - Method for fabricating light emitting diode (LED) dice with wavelength conversion layers (2016-04-12),

SemiLEDs Optoelectronics Co., Ltd. is a global provider of high-performance LED chips and components. With vertically integrated manufacturing facilities in Taiwan, SemiLEDs develops and produces a wide range of LED products for various applications including general lighting, specialty lighting, and backlighting. Committed to sustainability, SemiLEDs focuses on improving energy efficiency and reducing environmental impact through their cutting-edge LED technology.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

105 Patents

#1 in Chu-nan

#218 in Taiwan

#7,253 in the World

Chu-nan, Taiwan

Semileds Optoelectronics Co., Ltd.

Forward Citations = 646

35 inventors:

Chen-Fu Chu (47 out of 61 patents)

Wen-Huang Liu (39 out of 59 patents)

Trung Tri Doan (33 out of 434 patents)

4. Chao-Chen Cheng (28 out of 29 patents)

5. Hao-Chun Cheng (28 out of 30 patents)

Please report any incorrect information to support@idiyas.com

Loading…