The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2016
Filed:
Nov. 14, 2014
Applicant:
Semileds Optoelectronics Co., Ltd., Chu-nan Site, Chu-nan, TW;
Inventors:
Jui-Kang Yen, Zhubei, TW;
De-Shuo Chen, New Taipei, TW;
Assignee:
SemiLEDS Optoelectronics Co., Ltd., Chu-nan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 33/505 (2013.01); H01L 21/6838 (2013.01); H01L 2933/0041 (2013.01);
Abstract
A method for fabricating light emitting diode (LED) dice includes the step of providing a wavelength conversion layer on a substrate on an adhesive layer configured to have reduced adhesiveness upon exposure to a physical energy, such as electromagnetic radiation or heat. The method also includes the step of exposing the adhesive layer on the substrate to the physical energy to reduce the adhesiveness of the adhesive layer, removing the wavelength conversion layer from the substrate, and attaching the wavelength conversion layer to the light emitting diode (LED) die.