For the Inventor, By the Inventor

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Coeur d'Alene, ID, United States of America

Rohinni, Inc.

USPTO Granted Patents = 66

% Expired Patents = 4.5

EPO Patents = 8

Forward Citations = 141

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16 inventors (with patents filed for the assignee):

Cody George Peterson (62 out of 89 patents)

Andrew Parris Huska (61 out of 80 patents)

Clinton Adams (30 out of 30 patents)

4. Sean Kupcow (24 out of 25 patents)

5. Justin Wendt (13 out of 15 patents)

6. Kasey Christie (6 out of 6 patents)

7. Monica Hansen (5 out of 14 patents)

8. Clint Adams (5 out of 5 patents)

9. Andy Huska (3 out of 3 patents)

10. Orin Michael Ozias (3 out of 44 patents)

11. Luke Dupin (2 out of 2 patents)

12. Lars Huschke (2 out of 5 patents)

13. Peter R Bokma (2 out of 10 patents)

14. John A Solgat (1 out of 1 patent)

15. Keenan Allison (1 out of 1 patent)

Core Competencies:

Light Apparatus

Direct Transfer

Semiconductor Die

Embedding Techniques

Backlighting

Transfer Parameters

LED Array

Illumination Sources

Substrate Transfer

Micro-Adjustment

Compliant Needle

66 patents: Sort by Forward Citations

1. 12094365 - Multi-function light apparatus (2024-09-17),

2. 12040207 - Apparatus and method for orientation of semiconductor device die (2024-07-16),

3. 11967515 - Bridge apparatus and method for semiconductor die transfer (2024-04-23),

4. 11789196 - Electronic device with light-generating sources to illuminate an indicium (2023-10-17),

5. 11728195 - Apparatuses for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate (2023-08-15),

6. 11728189 - Apparatus to control transfer parameters during transfer of semiconductor devices (2023-08-15),

7. 11562990 - Systems for direct transfer of semiconductor device die (2023-01-24),

8. 11551591 - Multi-function light apparatus (2023-01-10),

9. 11538699 - Method and apparatus for embedding semiconductor devices (2022-12-27),

10. 11515293 - Direct transfer of semiconductor devices from a substrate (2022-11-29),

11. 11488940 - Method for transfer of semiconductor devices onto glass substrates (2022-11-01),

12. 11462433 - Direct transfer apparatus for a pattern array of semiconductor device die (2022-10-04),

13. 11293603 - Light vectoring apparatus (2022-04-05),

14. 11282730 - Bridge apparatus for semiconductor die transfer (2022-03-22),

15. 11232968 - Variable pitch multi-needle head for transfer of semiconductor devices (2022-01-25),

Rohinni, Inc. is a technology company that specializes in the development and production of ultra-thin micro LEDs. Founded in 2012 and based in Idaho, USA, Rohinni offers innovative solutions for applications in various industries, including automotive, consumer electronics, signage, and more. Their advanced micro LED technologies enable the creation of flexible displays, smart lighting systems, and other cutting-edge products. With a focus on delivering bright, efficient, and customizable solutions, Rohinni is driving the future of illumination and visual experiences.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 15 2026

66 Patents

#1 in Coeur d'Alene, ID

#15 in Idaho

#5,516 in US

#11,140 in the World

Coeur d'Alene, ID, United States of America

Rohinni, Inc.

Forward Citations = 141

16 inventors:

Cody George Peterson (62 out of 89 patents)

Andrew Parris Huska (61 out of 80 patents)

Clinton Adams (30 out of 30 patents)

4. Sean Kupcow (24 out of 25 patents)

5. Justin Wendt (13 out of 15 patents)

Please report any incorrect information to [email protected]

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