For the Inventor, By the Inventor

Enter assignee name

Coeur d'Alene, ID, United States of America

Rohinni, Inc.

USPTO Granted Patents = 66

% Expired Patents = 4.5

EPO Patents = 8

Forward Citations = 141

Loading Chart...

Loading Chart...

16 inventors (with patents filed for the assignee):

Cody George Peterson (62 out of 89 patents)

Andrew Parris Huska (61 out of 80 patents)

Clinton Adams (30 out of 30 patents)

4. Sean Kupcow (24 out of 25 patents)

5. Justin Wendt (13 out of 15 patents)

6. Kasey Christie (6 out of 6 patents)

7. Monica Hansen (5 out of 14 patents)

8. Clint Adams (5 out of 5 patents)

9. Andy Huska (3 out of 3 patents)

10. Orin Michael Ozias (3 out of 44 patents)

11. Luke Dupin (2 out of 2 patents)

12. Lars Huschke (2 out of 5 patents)

13. Peter R Bokma (2 out of 10 patents)

14. John A Solgat (1 out of 1 patent)

15. Keenan Allison (1 out of 1 patent)

Core Competencies:

Light Apparatus

Direct Transfer

Semiconductor Die

Embedding Techniques

Backlighting

Transfer Parameters

LED Array

Illumination Sources

Substrate Transfer

Micro-Adjustment

Compliant Needle

66 patents: Sort by Forward Citations

1. 12094365 - Multi-function light apparatus (2024-09-17),

2. 12040207 - Apparatus and method for orientation of semiconductor device die (2024-07-16),

3. 11967515 - Bridge apparatus and method for semiconductor die transfer (2024-04-23),

4. 11789196 - Electronic device with light-generating sources to illuminate an indicium (2023-10-17),

5. 11728195 - Apparatuses for executing a direct transfer of a semiconductor device die disposed on a first substrate to a second substrate (2023-08-15),

6. 11728189 - Apparatus to control transfer parameters during transfer of semiconductor devices (2023-08-15),

7. 11562990 - Systems for direct transfer of semiconductor device die (2023-01-24),

8. 11551591 - Multi-function light apparatus (2023-01-10),

9. 11538699 - Method and apparatus for embedding semiconductor devices (2022-12-27),

10. 11515293 - Direct transfer of semiconductor devices from a substrate (2022-11-29),

11. 11488940 - Method for transfer of semiconductor devices onto glass substrates (2022-11-01),

12. 11462433 - Direct transfer apparatus for a pattern array of semiconductor device die (2022-10-04),

13. 11293603 - Light vectoring apparatus (2022-04-05),

14. 11282730 - Bridge apparatus for semiconductor die transfer (2022-03-22),

15. 11232968 - Variable pitch multi-needle head for transfer of semiconductor devices (2022-01-25),

Rohinni, Inc. is a technology company based in Coeur d'Alene, Idaho, specializing in advanced semiconductor devices. The organization focuses on developing innovative light apparatus and embedding techniques that enhance illumination sources, particularly in LED arrays. Rohinni's expertise encompasses direct transfer methods and transfer parameters, enabling the integration of semiconductor die into various applications. Their work aims to revolutionize backlighting solutions and improve the efficiency and performance of lighting technologies across multiple industries.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

66 Patents

#2 in Coeur d'Alene, ID

#15 in Idaho

#5,522 in US

#11,155 in the World

Coeur d'Alene, ID, United States of America

Rohinni, Inc.

Forward Citations = 141

16 inventors:

Cody George Peterson (62 out of 89 patents)

Andrew Parris Huska (61 out of 80 patents)

Clinton Adams (30 out of 30 patents)

4. Sean Kupcow (24 out of 25 patents)

5. Justin Wendt (13 out of 15 patents)

Please report any incorrect information to [email protected]

Loading…