logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11562990 B1

PDFFull Text
Date of Patent:
Jan. 24, 2023

Filed:

Nov. 25, 2019

Systems for direct transfer of semiconductor device die

Applicant:

Rohinni, Llc, Coeur d'Alene, ID (US);

Inventors:

Andrew Huska, Liberty Lake, WA (US);

Cody Peterson, Hayden, ID (US);

Clinton Adams, Coeur d'Alene, ID (US);

Sean Kupcow, Greenacres, WA (US);

Assignee:

Rohinni, Inc., Coeur D'Alene, ID (US);

Attorney:

Lee & Hayes, P.C.

Primary Examiner:

Minh N Trinh

Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 21/683 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/677 (2006.01); H01L 21/68 (2006.01); H01L 21/687 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 33/62 (2010.01); G02F 1/13357 (2006.01); H01L 23/532 (2006.01); G02F 1/1335 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); G02F 1/133603 (2013.01); G02F 1/133605 (2013.01); G02F 1/133606 (2013.01); H01L 21/4853 (2013.01); H01L 21/67132 (2013.01); H01L 21/67144 (2013.01); H01L 21/67196 (2013.01); H01L 21/67265 (2013.01); H01L 21/67715 (2013.01); H01L 21/67778 (2013.01); H01L 21/681 (2013.01); H01L 21/6836 (2013.01); H01L 21/68742 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); H01L 23/53242 (2013.01); H01L 23/544 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 24/89 (2013.01); H01L 33/62 (2013.01); G02F 1/133612 (2021.01); H01L 24/81 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/54413 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/7531 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75261 (2013.01); H01L 2224/75262 (2013.01); H01L 2224/75303 (2013.01); H01L 2224/75314 (2013.01); H01L 2224/75317 (2013.01); H01L 2224/75651 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/75824 (2013.01); H01L 2224/75842 (2013.01); H01L 2224/75843 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81205 (2013.01); H01L 2224/81224 (2013.01); H01L 2224/83224 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/405 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A system for performing a direct transfer of a semiconductor device die includes a first conveyance mechanism to convey a first substrate, and a second conveyance mechanism to convey a second substrate with respect to the first substrate. The first substrate includes a first side and a second side, and the semiconductor device die is disposed on the first side of the first substrate. The second conveyance mechanism includes a first portion and a second portion to clamp the second substrate adjacent to a first side of the first substrate. The first portion of the second conveyance mechanism has a concave shape and the second portion of the second conveyance mechanism has a convex counter shape corresponding to the concave shape of the first portion. The system also includes a transfer mechanism disposed adjacent to the first conveyance mechanism to effectuate the direct transfer.

Find Patent Forward Citations

Loading…