Greenacres, WA, United States of America

Sean Kupcow

This inventor holds 25 USPTO granted patents and 3 published patent applications and 1 EPO patent, primarily in Semiconductor Device Transfer. Top assignees: Rohinni, Inc., Cowles Semi, LLC. Active years: 2017-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sean Kupcow. Retrieved from https://idiyas.com/inventor/sean-kupcow

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25 

% Patents Active = 96.0

 

Average Co-Inventor Count = 4.0

ph-index = 5

Forward Citations = 75(Granted Patents)


Company Filing History:


Years Active: 2017-2025

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Areas of Expertise:
Semiconductor Devices
Direct Transfer
Device Die Orientation
Substrate Transfer
Glass Substrates
Stacking Techniques
Needle Retraction
Dampening Force
LED Array
Support Substrate
Compliant Needle
Flexible Substrate
25 patents (USPTO):Explore Patents

Title: Innovations by Sean Kupcow: Pioneering Semiconductor Device Transfers

Introduction

Sean Kupcow is an accomplished inventor based in Greenacres, WA, with an impressive portfolio of 25 patents. His work primarily focuses on enhancing the methods of transferring semiconductor devices, significantly impacting the efficiency and precision of production processes in the semiconductor industry.

Latest Patents

Among his latest contributions to the field are two notable patents. The first is a "Method and apparatus for multiple axis direct transfers of semiconductor devices." This innovative apparatus allows for the direct transfer of a semiconductor device die from a wafer tape to a substrate. It features a dual-frame system: one frame holds the wafer tape while the other secures the substrate, ensuring precise alignment during the transfer process. A specially designed needle and actuator work in tandem to facilitate the exact positioning and pressing of the semiconductor device die.

The second patent focuses on an "Apparatus and method for orientation of semiconductor device die." This invention employs both an alignment and orientation mechanism to queue and position the die accurately prior to transfer. Utilizing magnetic forces, the apparatus ensures that each semiconductor die is oriented in a predetermined position, ready for seamless integration into the substrate.

Career Highlights

Throughout his career, Sean has made significant strides in semiconductor technology, showcasing his expertise while working with leading companies in the industry, including Rohinni, Inc. and Cowles Semi, LLC. His experience in these organizations has equipped him with insights that directly contribute to his innovative solutions.

Collaborations

Sean has collaborated with key professionals in the field, including Andrew Parris Huska and Cody George Peterson. These partnerships have allowed for cross-pollination of ideas and techniques, fostering an environment ripe for innovation.

Conclusion

In summary, Sean Kupcow's wealth of patents reflects his dedication to advancing semiconductor technology through innovative methodologies for device transfers. His work continues to influence the industry positively, paving the way for more efficient and accurate processes. As the semiconductor landscape evolves, Sean's contributions will undoubtedly remain a cornerstone of progress in this vital sector.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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