The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
Jul. 29, 2021
Applicant:
Rohinni, Inc., Liberty Lake, WA (US);
Inventors:
Cody Peterson, Hayden Lake, ID (US);
Keenan Allison, Coeur d'Alene, ID (US);
Brian Miner, Valleyford, WA (US);
Sean Kupcow, Greenacres, WA (US);
Assignee:
Rohinni, Inc., Liberty Lake, WA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68 (2013.01); H01L 21/67271 (2013.01);
Abstract
An apparatus for aligning and orienting a semiconductor die ('die') to be transferred to a substrate. The apparatus includes an alignment mechanism to align the die to be queued among a plurality of die; and an orientation mechanism to orient the die using magnetism to be positioned in a predetermined position prior to transfer to the substrate. The alignment mechanism further transports the die to be positioned at a feeding position for supply to a die transfer system.