The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2022

Filed:

May. 15, 2019
Applicant:

Rohinni, Llc, Coeur d'Alene, ID (US);

Inventors:

Cody Peterson, Hayden, ID (US);

Andrew Huska, Liberty Lake, WA (US);

Justin Wendt, Post Falls, ID (US);

Assignee:

Rohinni, LLC, Coeur d'Alene, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G02F 1/13357 (2006.01); H01L 23/00 (2006.01); H01L 33/54 (2010.01); B32B 37/00 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01); H01L 33/00 (2010.01); G02F 1/1335 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67132 (2013.01); B32B 37/025 (2013.01); G02F 1/133603 (2013.01); H01L 21/67144 (2013.01); H01L 21/68 (2013.01); H01L 21/6836 (2013.01); H01L 24/00 (2013.01); H01L 33/00 (2013.01); H01L 33/54 (2013.01); B32B 2457/14 (2013.01); G02F 1/133605 (2013.01); G02F 1/133606 (2013.01); G02F 1/133612 (2021.01); H01L 2221/68336 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/753 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75262 (2013.01); H01L 2224/75263 (2013.01); H01L 2224/75301 (2013.01); H01L 2224/75343 (2013.01); H01L 2224/75701 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/75704 (2013.01); H01L 2224/75705 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/75901 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/8122 (2013.01); H01L 2224/81121 (2013.01); H01L 2224/81201 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81205 (2013.01); H01L 2224/81224 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/81862 (2013.01); H01L 2224/81905 (2013.01); H01L 2933/005 (2013.01);
Abstract

An apparatus includes a product substrate having a transfer surface, and a semiconductor die defined, at least in part, by a first surface adjoined to a second surface that extends in a direction transverse to the first surface. The transfer surface includes ripples in a profile thereof such that an apex on an individual ripple is a point on a first plane and a trough on the individual ripple is a point on a second plane. The semiconductor die is disposed on the transfer surface between the first plane and the second plane such that the second surface of the semiconductor die extends transverse to the first plane and the second plane.


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