The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2022
Filed:
Aug. 02, 2019
Applicant:
Rohinni, Llc, Coeur d'Alene, ID (US);
Inventor:
Andrew Huska, Liberty Lake, WA (US);
Assignee:
Rohinni, LLC, Coeur d'Alene, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/677 (2006.01); H01L 21/683 (2006.01); H01L 21/68 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67715 (2013.01); H01L 21/67706 (2013.01); H01L 21/681 (2013.01); H01L 21/6836 (2013.01);
Abstract
An apparatus for transferring a semiconductor die ('die') from the first substrate to the second substrate. The apparatus includes a stage configured to hold a product substrate. A first bridge holds a transfer mechanism assembly. A second bridge holds a die substrate holder configured to hold the first substrate. A controller is configured to cause the first bridge and the second bridge to move to align the transfer mechanism assembly with the die on the first substrate with a transfer position on the second substrate where the die is to be transferred.