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For the Inventor, By the Inventor

Kobe, Japan

Ishihara Chemical Co., Ltd.


USPTO Granted Patents = 27



Trademarks = 1

Forward Citations = 132

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53 inventors (with patents filed for the assignee):

goldMedal Masaru Hatabe (8 out of 8 patents)

silverMedal Zvi Yaniv (5 out of 98 patents)

bronzeMedal Takahiro Tanaka (4 out of 4 patents)

4.  Peter B Laxton (4 out of 19 patents)

5.  Yunjun Li (4 out of 21 patents)

6.  Mohshi Yang (4 out of 22 patents)

7.  David Max Roundhill (4 out of 9 patents)

8.  Shoya Iuchi (3 out of 3 patents)

9.  Fuka Yamaoka (3 out of 3 patents)

10.  Yusuke Maeda (3 out of 7 patents)

11.  Yuichi Kawato (3 out of 3 patents)

12.  Tomio Kudo (3 out of 3 patents)

13.  Hidemi Nawafune (3 out of 14 patents)

14.  Kiyotaka Tsuji (3 out of 4 patents)

15.  Keigo Obata (3 out of 15 patents)


27 patents:

1. 12519071 - Structure containing Sn layer or Sn alloy layer (2026-01-06),
2. 12448690 - Treatment method after plating with Sn or Sn alloy (2025-10-21),
3. 12388035 - Structure comprising under barrier metal and solder layer, and method for producing structure (2025-08-12),
4. 11993862 - Structure including copper plating layer or copper alloy plating layer (2024-05-28),
5. 11946153 - Copper or copper alloy electroplating bath (2024-04-02),
6. 11939691 - Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bath (2024-03-26),
7. 11052637 - Structure containing Sn layer or Sn alloy layer (2021-07-06),
8. 10329644 - Ta—Nb alloy powder and anode element for solid electrolytic capacitor (2019-06-25),
9. 10231344 - Metallic ink (2019-03-12),
10. 10062657 - Method for manufacturing alloy bump (2018-08-28),
11. 9905339 - Conductive film forming method and sintering promoter (2018-02-27),
12. 9730333 - Photo-curing process for metallic inks (2017-08-08),
13. 9615455 - Copper particulate dispersion, conductive film forming method and circuit board (2017-04-04),
14. 9131610 - Buffer layer for sintering (2015-09-08),
15. 9120944 - Copper particulate dispersion, conductive film forming method and circuit board (2015-09-01),
Ishihara Chemical Co., Ltd. is a global chemical company based in Japan. With a history spanning over 100 years, Ishihara Chemical specializes in the production and distribution of high-quality chemical products for various industries. Their product portfolio includes functional chemicals, pharmaceuticals, agrochemicals, and specialty chemicals. They are committed to innovation, sustainability, and customer satisfaction, and strive to contribute to the advancement of society through their chemical solutions.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Jan 6 2026

27 Patents

#15 in Kobe

#2,405 in Japan

#23,315 in the World

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Kobe, Japan

Ishihara Chemical Co., Ltd.

Forward Citations = 132

53 inventors:

goldMedal Masaru Hatabe (8 out of 8 patents)

silverMedal Zvi Yaniv (5 out of 98 patents)

bronzeMedal Takahiro Tanaka (4 out of 4 patents)

4.  Peter B Laxton (4 out of 19 patents)

5.  Yunjun Li (4 out of 21 patents)

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