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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9131610 B1

PDFFull Text
Date of Patent:
Sep. 08, 2015

Filed:

Nov. 07, 2013

Buffer layer for sintering

Applicants:

Applied Nanotech Holdings, Inc., Austin, TX (US);

Ishihara Chemical Co., Ltd., Hyogo-ku, Hyogo, JP;

Inventors:

Zvi Yaniv, Austin, TX (US);

Mohshi Yang, Austin, TX (US);

Peter B. Laxton, Alameda, CA (US);

Assignees:

PEN Inc., Deerfield Beach, FL (US);

Ishihara Chemical Co., Ltd., Hyogo-Ku, Hyogo, JP;

Attorneys:

Kelly Kordzik

Matheson Keys & Kordzik PLLC

Primary Examiner:

Marc Armand

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H05K 1/09 (2006.01); B22F 3/105 (2006.01); B22F 7/04 (2006.01); B23K 26/34 (2014.01); H01L 21/268 (2006.01); H01L 21/48 (2006.01); H05K 3/46 (2006.01); H01L 21/288 (2006.01); H01L 23/532 (2006.01); H05K 1/02 (2006.01); H05K 3/10 (2006.01); B23K 26/32 (2014.01); B23K 35/02 (2006.01); H01L 21/768 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/092 (2013.01); B22F 3/105 (2013.01); B22F 7/04 (2013.01); B23K 26/3266 (2013.01); B23K 26/3273 (2013.01); B23K 26/34 (2013.01); B23K 35/0244 (2013.01); H01L 21/268 (2013.01); H01L 21/288 (2013.01); H01L 21/4867 (2013.01); H01L 21/76877 (2013.01); H01L 23/5328 (2013.01); H05K 1/0201 (2013.01); H05K 3/10 (2013.01); H05K 3/1283 (2013.01); H05K 3/4664 (2013.01); B22F 2998/00 (2013.01); B23K 2201/36 (2013.01); H05K 3/125 (2013.01); H05K 2201/062 (2013.01); H05K 2203/107 (2013.01); Y10T 29/49156 (2015.01);
Abstract

A layer of material having a low thermal conductivity is coated over a substrate. A film of conductive ink is then coated over the layer of material having the low thermal conductivity, and then sintered. The film of conductive ink does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.

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Quick Actions:

Yaniv, Zvi. (2015). Buffer layer for sintering (U.S. Patent No. 9131610). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9131610

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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