The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2018
Filed:
Oct. 09, 2015
Applicant:
Ishihara Chemical Co., Ltd., Hyogo, JP;
Inventors:
Shoya Iuchi, Hyogo, JP;
Masaru Hatabe, Hyogo, JP;
Assignee:
ISHIHARA CHEMICAL CO., LTD., Hyogo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 24/13 (2013.01); H05K 3/34 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11848 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01);
Abstract
In order to manufacture an alloy bump, a resist pattern having openings which expose a substrate is formed on the substrate, an under-bump metal is formed on the substrate inside the openings, a first plating film is formed on the under-bump metal by electroplating, a second plating film containing no metal components which are contained in the first plating film is formed on the first plating film by electroplating, the resist pattern is removed, and the alloy bump is formed by heat treating the substrate to thereby alloy the first plating film and the second plating film.