The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2025
Filed:
Jun. 15, 2021
Applicant:
Ishihara Chemical Co., Ltd., Kobe, JP;
Inventors:
Assignee:
ISHIHARA CHEMICAL CO., LTD., Kobe, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 24/03 (2013.01); H01L 24/04 (2013.01); H01L 24/13 (2013.01); H01L 24/11 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05157 (2013.01); H01L 2224/0516 (2013.01); H01L 2224/05609 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/014 (2013.01);
Abstract
A structure including a solder layer has a substrate, a solder layer formed on the substrate, and an under barrier metal formed as an alloy layer containing Fe and Co between the substrate and the solder layer. An internal stress of the under barrier metal is 260 Mpa or less. The structure having an under barrier metal and a solder layer is produced by successively forming on the substrate, the under barrier metal and the solder layer by a plating method.