Forward Citations = 32

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5 inventors (with patents filed for the assignee):

Gerald K Fehr (3 out of 7 patents)

EE-Chang Ong (3 out of 3 patents)

Victor Batinovich (2 out of 2 patents)

4. Ee Chang Ong (1 out of 2 patents)

5. E C Ong (1 out of 2 patents)

8 patents: Sort by Forward Citations

1. 6269723 - Method and apparatus for enhancement of a punch guide/receptor tool in a dambar removal system (2001-08-07),

2. 6058602 - Method for encapsulating IC packages with diamond substrate (2000-05-09),

3. 5766535 - Pressure-plate-operative system for one-side injection molding of (1998-06-16),

4. 5497681 - Method for making an IC lead-frame punch (1996-03-12),

5. 5495780 - Method for sharpening an IC lead-frame punch (1996-03-05),

6. 5491110 - Metal semiconductor package with an external plastic seal (1996-02-13),

7. 5452635 - Apparatus for integrated circuit lead-frame punching (1995-09-26),

8. 5436407 - Metal semiconductor package with an external plastic seal (1995-07-25),

Company Overview

Integrated Packaging Assembly Corporation is a leading provider of packaging solutions for various industries. With a focus on innovation and quality, we offer a wide range of services including packaging design, assembly, and distribution. Our team is dedicated to delivering cost-effective and efficient solutions to our customers.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

8 Patents

#591 in San Jose, CA

#8,540 in California

#35,924 in US

San Jose, CA, United States of America

Integrated Packaging Assembly Corporation

Forward Citations = 32

5 inventors:

Gerald K Fehr (3 out of 7 patents)

EE-Chang Ong (3 out of 3 patents)

Victor Batinovich (2 out of 2 patents)

4. Ee Chang Ong (1 out of 2 patents)

5. E C Ong (1 out of 2 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Integrated Packaging Assembly Corporation. Retrieved from https://idiyas.com/company/integrated-packaging-assembly

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]