Company Filing History:
Years Active: 1995-1996
Title: The Innovative Contributions of EE-Chang Ong
Introduction
EE-Chang Ong is a notable inventor based in Cupertino, CA. He has made significant contributions to the field of integrated circuit manufacturing. With a total of 3 patents to his name, his work focuses on enhancing the efficiency and effectiveness of lead-frame punches used in the industry.
Latest Patents
EE-Chang Ong's latest patents include innovative methods for making and sharpening IC lead-frame punches. The first patent describes a punch designed for removing material from lead frames. This punch features a substantially rectangular body with an array of grooves along one side. A step is removed on one end from the side opposite the grooves, creating an array of punch teeth extending from the body. The grooves allow for reworking the punch to create a new array of teeth by machining away all or part of the existing teeth. This design enables the punch to be reworked multiple times before disposal, significantly extending its lifespan. The second patent outlines a similar method for sharpening the IC lead-frame punch, emphasizing the same innovative features and benefits.
Career Highlights
EE-Chang Ong is currently associated with Integrated Packaging Assembly Corporation, where he applies his expertise in developing advanced manufacturing techniques. His work has been instrumental in improving the production processes within the company.
Conclusion
EE-Chang Ong's contributions to the field of integrated circuit manufacturing through his innovative patents demonstrate his commitment to enhancing industry standards. His work not only improves efficiency but also promotes sustainability in manufacturing practices.