E C Ong

Title: E C Ong: Innovator in Injection Molding Technology

Introduction

E C Ong is a notable inventor based in Cupertino, CA (US). He has made significant contributions to the field of injection molding technology, particularly in the encapsulation of substrate-mounted integrated circuits (ICs). With a total of 2 patents, his work has advanced the efficiency and effectiveness of molding processes.

Latest Patents

E C Ong's latest patents focus on a pressure-plate-operative system for one-side injection molding. This innovative mold system is designed for encapsulating substrate-mounted ICs. The system features a split mold with a lower cavity for positioning the substrate and an upper cavity that provides a volume space around the IC. The lower cavity includes a compressible shim plate that allows for varying substrate thicknesses, ensuring that the mold can accommodate different parts effectively. As the mold closes, the upper mold portion compresses the shim plate, allowing for intimate contact with both the substrate and the lower mold portion. This design enhances the encapsulation process, making it more versatile and efficient.

Career Highlights

Throughout his career, E C Ong has worked with several companies, including Integrated Packaging Assembly Corporation and Ipac, Inc. His experience in these organizations has contributed to his expertise in the field of packaging and molding technologies.

Collaborations

Due to space constraints, the details of E C Ong's collaborations will not be included.

Conclusion

E C Ong's innovative work in injection molding technology has made a significant impact on the encapsulation of substrate-mounted ICs. His patents reflect a deep understanding of the complexities involved in molding processes, showcasing his role as a key inventor in this field.