Gerald K Fehr

Title: Gerald K. Fehr: Innovator in Integrated Circuit Packaging

Introduction

Gerald K. Fehr is a notable inventor based in Cupertino, CA, with a focus on advancements in integrated circuit (IC) packaging technology. He holds a total of 7 patents, showcasing his contributions to the field of electronics and thermal management.

Latest Patents

Fehr's latest patents include innovative methods for manufacturing IC packages that utilize diamond substrates as thermal conductors. One of his patents describes a method for placing a diamond substrate in a lower cavity of an encapsulation mold. This design ensures that the diamond substrate underlies the die attach pad and is in close proximity to the leads, facilitating efficient heat transfer from an operating IC. The apparatus disclosed in his patents includes features for positioning and supporting diamond substrates, as well as combination heat slugs that bond diamond substrates to metal slugs.

Career Highlights

Throughout his career, Gerald K. Fehr has worked with several companies, including Integrated Packaging Assembly Corporation and Ipac, Inc. His work has significantly impacted the development of IC packaging technologies, particularly in enhancing thermal management through innovative materials.

Collaborations

Fehr has collaborated with notable professionals in the field, including Victor Batinovich and Willfred Marc Stalnaker. These collaborations have contributed to the advancement of technology in integrated circuit packaging.

Conclusion

Gerald K. Fehr's contributions to the field of integrated circuit packaging through his innovative patents and collaborations highlight his role as a significant inventor in the industry. His work continues to influence advancements in thermal management and IC technology.