Integrated Packaging Assembly Corporation

Ford Motor Company Limited

Ipac, Inc.

International Packaging and Assembly Corporation

Ose USA

Gerald K Fehr

Victor Batinovich

George Fujimoto

Willfred Marc Stalnaker

David Alexander St Clair V

Victor Wayne Ramsey

A method for manufacturing a plastic encapsulated integrated circuit (IC) package has steps for placing a diamond substrate in a lower cavity of an encapsulation mold such that the diamond substrate in the finished package underlies the die attach pad and a portion of the leads in close proximity to each. Pins are provided in lower cavities of molds to support and/or position diamond substrates to lie close to both die attach pads and leads to facilitate efficient heat transfer from an operating IC, through the die attach pad, into and through the diamond substrate, and finally to the leads leading from the encapsulated package. Apparatus is disclosed for positioning and supporting diamond substrates, and combination heat slugs for the purpose are disclosed, having diamond substrates bonded to metal slugs.

IC packages with diamond substrate thermal conductor

Method for encapsulating IC packages with diamond substrate

Apparatus for encapsulating IC packages with diamond substrate thermal

A method and apparatus for supporting a sensor in a vehicle in a manner to properly orient the axis of sensitivity of the sensor includes a lead frame having a substantially planar base portion with a plurality of leads extending from opposing ends thereof. The lead frame comprises a support plate portion extending perpendicularly from the base portion. A sensor and optional integrated circuit chip are mounted on the support plate portion. The lead frame further includes at least one support leg extending angularly between the base portion and support plate portion for rigidly supporting the support plate portion with respect to the base portion. Accordingly, a sensor, such as an accelerometer, may be positioned in the vehicle in a position mounted perpendicularly with respect to the mounting surface of the assembly in the vehicle for properly orienting the axis of sensitivity of the sensor.

Method and apparatus for supporting a sensor in a vehicle

A mold is provided for use in encapsulating integrated circuit (IC) dies attached to die attach pads of lead frames, wherein the mold has one or more support elements in cavities of the mold for supporting the die attach pad portions of the lead frame while the mold is closed on the lead frame and encapsulation material is injected to encapsulate the IC dies and die attach pads. The support elements are, in a preferred embodiment, pins extending from the surfaces of the cavities in the mold, and the pins keep the die attach pads from moving into contact with surfaces of the cavities, so die attach pads or dies are not exposed in finished packages. In a preferred embodiment the pins each are tapered in the extended portion, so the amount of exposure of the die attach pad is absolutely minimized. In another embodiment, the support elements are retractable. In still other embodiments, support elements are beads bonded to a lead frame strip or dimples provided to a lead frame strip in the process of manufacturing the strip. Methods for practicing the invention are provided as well.

Method for forming encapsulated IC packages

An improved metal semiconductor package is described. The semiconductor package includes a lead frame with a top side and a bottom side. A semiconductor is positioned on the top side of the lead frame. Bond wires electrically couple the lead frame to the semiconductor die. A metallic base is positioned at the bottom side of the lead frame. A metallic cap is positioned over the top side of the lead frame. The metallic cap includes a central aperture that is aligned with the semiconductor die. An external plastic seal is used to join the metallic base, lead frame, and metallic cap. The external plastic seal may be in the form of a perimeter seal or a body seal.

Metal semiconductor package with an external plastic seal

Growing community of inventors

Cupertino, CA, United States of America

Gerald K Fehr